ThermoSink Series
Thermal Management for PCBs
Silicone Encapsulant for Heat Management in PCBs and Automotive Applications
Thermosink gels and encapsulants offer superior heat management with flowability, cure rates, and firmness.
ThermoSink series is the latest material designed for low viscosity and superior flow performance, making it suitable for high-speed processing.
Applications:
- Automotive High Power: EV batteries and power train components/ABS, Superchargers
- Power tool batteries
- Robotics, electrical motor controls
- Amplifiers and Telecom
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The ThermoSink Family
The Thermosink family includes a full range of polymers with a variety of hardness values, viscosities, and cure times.
| Resin Designs | Mixed ViscResin Designs | Gel Time*Resin Designs | Cure TimeResin Designs | Specific GravityResin Designs | Mix RatioResin Designs | Thermal Cond.Resin Designs |
HardnessResin Designs | Flame ResistanceResin Designs |
|---|---|---|---|---|---|---|---|---|
| ThermoSink 35-3 | 15,000 CPS | 20 Mins | 4 Hrs (25ºC) 15 Mins (125ºC) |
2.9-3.2 | 1 to 1 | >3.4 W/mK | 55 Shore A | UL V-0 |
| ThermoSink 35-4 | 40,000 CPS | 10 Mins | 120 Mins(25ºC) <5 Mins (125ºC) |
2.9-3.5 | 1 to 1 | >3.4 W/mK | 55 Shore A | UL V-0 |
| ThermoSink-35-6 | 15,000-45,000 CPS | 30-60 Mins | 2 hrs (25°C) 45 Mins (100°C) |
2.87 | 1 to 1 | >3.5 W/mK | 65-75 Shore A | UL V-0 |
Learn More about Thermosink and Resin Designs Thermal Management