ThermoSink 35-7
Thermal Management for PCBs
Silicone Encapsulant for Heat Management in PCBs and Automotive Applications
Thermosink gels and encapsulants offer superior heat management with flowability, cure rates, and firmness.
ThermoSink 35-7 is the latest material designed for low viscosity and superior flow performance, making it suitable for high-speed processing.
Applications:
- Automotive High Power: EV batteries and power train components/ABS, Superchargers
- Power tool batteries
- Robotics, electrical motor controls
- Amplifiers and Telecom
Thermosink 35-7 key advantages include:
- Mixed viscosity < 10K CPS
- Superior flow and self-leveling properties
- Capable of high-speed processing
- Low outgassing (Passing ASTM E595-15)
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The ThermoSink Family
The Thermosink family includes a full range of polymers with a variety of hardness values, viscosities, and cure times.
| Resin Designs | Mixed ViscResin Designs | Gel Time*Resin Designs | Cure TimeResin Designs | Specific GravityResin Designs | Mix RatioResin Designs | Thermal Cond.Resin Designs |
HardnessResin Designs | Flame ResistanceResin Designs |
|---|---|---|---|---|---|---|---|---|
| ThermoSink 35-3 | 15,000 CPS | 20 Mins | 4 Hrs (25ºC) 15 Mins (125ºC) |
2.9-3.2 | 1 to 1 | >3.4 W/mK | 55 Shore A | UL V-0 |
| ThermoSink 35-4 | 40,000 CPS | 10 Mins | 120 Mins(25ºC) <5 Mins (125ºC) |
2.9-3.5 | 1 to 1 | >3.4 W/mK | 55 Shore A | UL V-0 |
| ThermoSink-35-6 | 15,000-45,000 CPS | 30-60 Mins | 2 hrs (25°C) 45 Mins (100°C) |
2.87 | 1 to 1 | >3.5 W/mK | 65-75 Shore A | UL V-0 |
| ThermoSink-35-7 | 6,000-10,000 CPS | 90-120 Mins | 5 hrs (25°C) 45 Mins (100°C) |
2.7 | 1 to 1 | >2.5 W/mK | 20-30 Shore A | UL V-0 |
Learn More about Thermosink and Resin Designs Thermal Management