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ThermoSink 35-7

Thermal Management for PCBs

Silicone Encapsulant for Heat Management in PCBs and Automotive Applications

Thermosink gels and encapsulants offer superior heat management with flowability, cure rates, and firmness. 

ThermoSink 35-7 is the latest material designed for low viscosity and superior flow performance, making it suitable for high-speed processing.

Applications:  

  • Automotive High Power: EV batteries and power train components/ABS, Superchargers
  • Power tool batteries
  • Robotics, electrical motor controls
  • Amplifiers and Telecom

Thermosink 35-7 key advantages include:

  • Mixed viscosity < 10K CPS
  • Superior flow and self-leveling properties
  • Capable of high-speed processing
  • Low outgassing (Passing ASTM E595-15)

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The ThermoSink Family

The Thermosink family includes a full range of polymers with a variety of hardness values, viscosities, and cure times.

Resin Designs Mixed ViscResin Designs Gel Time*Resin Designs Cure TimeResin Designs Specific GravityResin Designs Mix RatioResin Designs Thermal
Cond.
Resin Designs
HardnessResin Designs Flame
Resistance
Resin Designs
ThermoSink 35-3 15,000 CPS 20 Mins 4 Hrs (25ºC)
15 Mins (125ºC)
2.9-3.2 1 to 1 >3.4 W/mK 55 Shore A UL V-0
ThermoSink 35-4 40,000 CPS 10 Mins 120 Mins(25ºC)
<5 Mins (125ºC)
2.9-3.5 1 to 1 >3.4 W/mK 55 Shore A UL V-0
ThermoSink-35-6 15,000-45,000 CPS 30-60 Mins 2 hrs (25°C)
45 Mins (100°C)
2.87 1 to 1 >3.5 W/mK 65-75 Shore A UL V-0
ThermoSink-35-7 6,000-10,000 CPS 90-120 Mins 5 hrs (25°C)
45 Mins (100°C)
2.7 1 to 1 >2.5 W/mK 20-30 Shore A UL V-0

 

Learn More about Thermosink and Resin Designs Thermal Management